01. Industry Status & Technical Pain Points
Thermal Conductivity "Glass Ceiling"
Traditional thermal pads rely on physical filling of conductive powders (e.g., alumina, boron nitride) in polymers. Point contact between fillers creates large contact thermal resistance; overall thermal conductivity stays below 15 W/m·K, insufficient for 5G and HPC cooling.
"Soft" vs "Rigid" Physical Paradox
Metal or carbon composites with high thermal conductivity are typically rigid and cannot conform to rough or uneven surfaces; flexible materials have low intrinsic conductivity, and high filler loading reduces mechanical flexibility and reliability.
Core Solution: Structured Composite Thermal Skeleton
Our proprietary process combines "active fusion bonding" with "structured flexible engineering" to build a composite system with a 3D continuous thermal network.
Atomic-Level Metallurgical Bonding
Active elements react with thermal reinforcement surface; eliminate interface thermal resistance; build high-speed phonon/electron transport channels.
3D Continuous Skeleton
Special mesh or fiber mat as reinforcement base; "physical filling" becomes "structured layout"; coordinated temperature uniformity in both in-plane and through-thickness directions.
Stress Release
Precision geometry forms stress-release array; imparts fabric-like macroscopic flexibility and high compression resilience.
02. Core Technical Advantages
High Thermal Conductivity
Through-thickness effective thermal conductivity significantly higher than traditional products; rapid heat export from energy center.
Excellent 2D Temperature Uniformity
High in-plane thermal diffusivity; effectively eliminates hotspots; achieves highly uniform chip surface temperature.
Fabric-Like Conformability
Compression up to 30%+; well conforms to installation tolerances; significantly reduces interface contact thermal resistance.
Long-Life Reliability
Metallurgical locking prevents filler shedding, powdering, or pump-out; withstands extreme temperature cycling.
03. Application Window & Commercial Potential
5G/6G Communications
High-frequency PA, RF modules, high heat flux components.
AI Compute Core
HBM, edge server global thermal management.
New Energy Vehicles
SiC/GaN power modules; battery thermal control.
Precision Optoelectronics
High-power lasers; high-brightness LED arrays.