About Us

From superabrasive tools to high-performance thermal materials — from tool designers to carbon-based composite innovators.

CuFeng / ToSpike

Nanjing CuFeng Mechanical & Electrical Technology Co., Ltd.

Located in Jiangbei New Area, Nanjing

Company Profile

CuFeng (ToSpike) specializes in carbon-based interface engineering, spanning from atomic-level active fusion bonding to a carbon-based composite platform on sp³–sp² hybrid bonding.

Besides superabrasive tools (Diamond/CBN), work also covers thermal management, structural strength, and electromagnetic protection for semiconductor manufacturing, aerospace, AI computing, and new energy systems.

R&D & Engineering Capability

A decade-plus of expertise in vacuum interface metallurgy and active fusion bonding, applying microscopic process control to extreme machining of cast metals, CFRP, and hard brittle materials, and extending into custom tools and functional materials.

From Industrial Practice to Physics Exploration

Design principles from superabrasive tools now drive high-performance thermal management, shifting from precision tools toward a functional materials platform, with continued exploration of carbon structures in properties, interfaces, and endogenous dynamics.

Corporate Vision

Continued materials and process development for high-power-density thermal management, new energy, and solid-state batteries.

Core Philosophy

New technology, new heights — from superabrasive tools to a carbon-based composite platform.

Core Team

Technical team

Wang Bo

Wang Bo

Head of Technical R&D & Applications
Professional Background

PhD in Engineering (2016); focused on precision machining with superabrasive tools for difficult-to-machine materials.

Technical Credentials

Deep industrialization experience; 30+ granted invention and utility model patents.

Core Capabilities

Expert in customized system solutions for extreme conditions—titanium alloys, superalloys, silicon carbide, CFRP—via deep sp³–sp² interface matching.

Skilled in cost- and volume-oriented product development, driving adoption through process improvement.

Precision MachiningInterface EngineeringPatent Portfolio

He Jun

He Jun

Head of Engineering Design & Structure
Professional Background

Master of Mechanical Engineering, Senior Engineer; 17+ years in defense electronics R&D, focusing on structural and thermal design; led complex equipment programs at defense institutes.

Technical Credentials

Long track record in defense electronics R&D; led structural design for key programs.

Core Capabilities

Expert in structure–thermal coupling design for complex electronics, concept to implementation; deep expertise in high-power-density thermal design with reliable, innovative paths.

Proven engineering practice with strong problem closure, balancing performance, reliability, manufacturability.

Structural DesignThermal ManagementEngineering Implementation

Engineer Zhang

Engineer Zhang

Head of Application Engineering & Field Support
Professional Background

Seasoned diamond tool application specialist; years of expertise in superhard abrasives and material removal; adept at complex grinding challenges.

Technical Credentials

Deep field expertise in new-energy & precision manufacturing; led grinding-process rollouts for leading customers.

Core Capabilities

Delivers end-to-end support from tool selection to process optimization; provides durable tooling for new-energy powertrain (battery, motor, e-drive) and chassis assembly.

Establishes rapid-response workflows for grinding diagnostics, process validation, and on-site training; drives data-backed implementation for sustained production stability.

Tool SelectionField SupportEV Assembly

Core Milestones

Key milestones from launch to the present

2025

Patent cluster and technology layout

Completed 9 core patent filings covering the path from diamond tools to the sp³–sp² carbon-based interface.

2025

High-performance thermal management material breakthrough

Developed diamond-copper composite reaching 680 W/m·K, marking entry into high-power electronic thermal management.

2023

Strategic relocation and capability upgrade

R&D center relocated to Jiangbei New Area, Nanjing, leveraging regional R&D advantages to accelerate commercialization of superhard material fundamentals.

2018

CuFeng launch

Founded in Zhenjiang, the company established its "new technology, new heights" philosophy, focused on interface bonding for difficult-to-machine materials.