Technical Achievements
From superabrasive tools to carbon-based thermal management materials
Diamond-copper composite
Achieved 680 W/m·K thermal conductivity; limit-performance version targets 1000+ W/m·K. Dual lines: cost-effective civilian and high-end use.
Thermal interface material (TIM)
Flexible thermal solution based on copper mesh/copper fiber. Active fusion bonding of diamond particles forms a 3D skeleton conductive phase; a structural design aimed at high thermal conductivity and flexibility.
All-carbon composite
sp³–sp² 3D structure technology platform. Extensible to solid-state battery anodes, superconducting materials, and other frontier fields; 5–10 year core technology reserve.
Diamond nonstick coating
Patented diamond particle bonding for wear resistance and nonstick performance. Mass production ready.
Superabrasive fusion-bonded tools solutions
(Superabrasive Fusion-Bonded Solutions)
Rooted in interfacial chemical metallurgy, active fusion bonding joins diamond/CBN to metal substrates; substrate–superabrasive–alloy matching delivers custom machining for aerospace, semiconductor, and advanced composites.
Note: All data above are typical laboratory values or theoretical design values. Due to application conditions and specification differences, actual performance parameters are subject to formal contracts or product manuals.
This materials-and-physics platform began in engineering practice and now spans materials science, functional materials, and fundamental physics — starting with diamond-copper and evolving continuously.