From superabrasive tools to carbon-based thermal management materials
Achieved 680 W/m·K thermal conductivity; limit-performance version can reach 1000+ W/m·K. Dual product line strategy covering cost-effective civilian and high-end applications.
Flexible thermal solution based on copper mesh/copper fiber. Active fusion bonding of diamond particles forms a 3D skeleton conductive phase; a structural design aimed at high thermal conductivity and flexibility.
sp³–sp² 3D structure technology platform. Extensible to solid-state battery anodes, superconducting materials, and other frontier fields; 5–10 year core technology reserve.
Patented diamond particle bonding for wear resistance and nonstick performance. Mass production ready.
(Superabrasive Fusion-Bonded Solutions)
Based on interfacial chemical metallurgy principles, active fusion bonding achieves atomic-level reliable connection between diamond or cubic boron nitride (CBN) and heterogeneous metal substrates. CuFeng goes beyond single tools; through precise matching of substrate–superabrasive–fusion alloy, customized precision machining and material removal solutions are provided for aerospace, semiconductor, and advanced composites.
Note: All data above are typical laboratory values or theoretical design values. Due to application conditions and specification differences, actual performance parameters are subject to formal contracts or product manuals.
The materials and physics platform presented here originated in engineering practice and has gradually opened space across materials science, functional materials, and fundamental physics. Diamond-copper composite is the project starting point, and development of the materials platform continues.