Diamond-Copper Composite
Samples reach 680 W/m·K. Two lines run in parallel: a cost-efficient high-volume civilian solution, and a limit version targeting 1000+ W/m·K, partially replacing CVD diamond.
Application Prospects
New concept for thermal management materials
Intended for high-power electronics thermal management, covering AI chips, new energy vehicles, 5G base stations, and aerospace.
View full application areasDual product lines driving growth
The cost-effective version targets high-volume civilian markets; the limit-performance version targets high-end industrial applications.
Cooperate with usDual Product Line Strategy
Cost-effective solution
Low-cost high-volume preparation through process optimization, targeting civilian markets and supporting scaled applications.
Application scenarios
- Consumer electronics thermal management (phones, tablets, laptops)
- LED lighting thermal management
- General industrial heat sinks
Limit-performance solution
Active fusion-bonded multi-grade diamond particle composite, design thermal conductivity of 1000+ W/m·K, can partially replace CVD solutions for high-end thermal management needs.
Application scenarios
- AI chips, GPU thermal management (high power density)
- Power devices (IGBT, SiC, GaN)
- Lasers, 5G base stations, aerospace
Technical Principle & Innovation
Core technology
3D structured diamond skeleton
Multi-grade particle packing with surface-modified diamond builds a self-supporting 3D skeleton, raising diamond volume fraction and forming a continuous heat-conduction path.
ToSpike active fusion-bonding solution
A self-developed low-melting-point active alloy is used to improve wettability of conventional diamond composites. The liquid alloy can infiltrate the skeleton and form a continuous heat-conduction network.
Preparation process
Skeleton construction
Titanium-coated diamond particles are filled into the mold in large, medium, and small order; vibration achieves dense packing to form a 3D continuous porous skeleton.
Fusion alloy filling
Active fusion alloy powder is vibration-filled into the pores of the diamond skeleton to ensure uniform distribution.
Pressure-assisted fusion
Heat in a vacuum hot-press furnace above the alloy liquidus, apply pressure and hold. Active elements synergistically form composite carbide interfaces, achieving reliable bonding between diamond and metal matrix.
Cooling and forming
Cool with the furnace to solidify, forming a highly dense diamond-copper composite structure. Can be further wire-cut to required dimensions.
Performance Parameters
Related Patent Technology
Related invention patents
A diamond-copper composite material and its preparation method
Discloses a preparation method using multi-grade diamond particle packing to build skeleton and active fusion liquid phase filling. Achieves high thermal conductivity, low cost, and large-size preparation.
A structured diamond thermal management substrate and its preparation method
Describes in detail key technologies including large, medium, and small diamond particle grading, titanium coating, coating process, and positioning screen-assisted filling.
Need diamond-copper thermal solutions?
The technical team will provide product selection and custom design based on thermal requirements