Built on sp³–sp² carbon hybrid bonding, the same methodology spans from thermal management to frontier physics exploration
Breaking thermal bottlenecks at extreme power density with 500–800 W/m·K efficient cooling.
New carbon-based high-thermal-conductivity materials and TIM solutions that meet high-performance and reliability requirements of thermal solutions across diverse application domains.
New preparation and processing technologies significantly reduce cost, driving mass adoption of high-thermal-conductivity diamond-copper products in new energy vehicle thermal management.
Interface engineering combined with cost-optimized processes, applied in mature consumer markets.
Exploring stress-field-induced band structures as a ten-year theoretical reserve for computing, extending to high-modulus carbon hosts, electrochemical electrodes, and extreme physics.
AI Chip Thermal Management Solution
Geometric coupling + Rapid thermal dilution + System-level synergy
Diamond-copper composite as DBC/AMB substrate or heat spreader rapidly extracts IGBT chip heat, reducing junction temperature and improving power density and reliability.
High-thermal-conductivity substrates with TIM address heat dissipation in pump sources and gain media, extending device lifetime.
Diamond-copper or flexible TIM for PA module thermal interface manages local heat flux at mmWave frequencies for stable base station operation.
T/R module multi-channel integration demands lightweight, reliable thermal management; diamond-copper heat spreaders enable high heat flux distribution.
High-thermal-conductivity carbon composite as inter-module TIM or cold plate contact layer improves pack thermal uniformity and reduces thermal runaway risk.
Diamond-copper or flexible TIM between IGBT/SiC modules and heat sink significantly reduces contact resistance and improves power density.
OBC power devices have high heat flux; diamond-copper heat spreaders enable rapid heat spreading and reduce system weight and volume.
DC/DC converter multi-chip layout requires high-thermal-conductivity TIM and heat spreaders for coordinated multi-source heat dissipation.
Diamond-copper composite conductor builds radial heat channels on copper wire surface, addressing ACR surge and thermal bottlenecks from skin effect for 11kW+ wireless charging.
sp³–sp² chemical bonding firmly anchors diamond particles on cookware surface for thermal, wear, and nonstick performance, with a longer service life than common polymer coatings.
Ultra-thin flexible TIM conforms to foldable hinge and hot chip areas for efficient heat spreading in limited space, ensuring fold reliability.
Lightweight thermal solutions replace metal heat sinks, enabling reliable cooling for key chips under VR/AR headset weight constraints.
Based on the same sp³–sp² carbon bonding platform, this module spans the full technology spectrum from foreseeable engineering extension to frontier physics exploration. Solid-state battery anodes and water treatment particle electrodes build on mature process paths with clear medium-term engineering potential; superconducting material research and quantum mesoscopic systems rely on the stress engineering platform and are in collaborative frontier exploration with academia. Together they demonstrate the platform's extensibility.
Foreseeable engineering extension based on sp³–sp² platform
sp³–sp² carbon skeleton as high-modulus host suppresses lithium dendrite growth via stress field, improving solid-state battery cycle life and safety.
High internal stress sp²–sp³ structure delivers high hardness, long life, and excellent electrical/catalytic activity for electrochemical water treatment electrodes.
Frontier exploration based on stress engineering, collaborative research stage
Based on sp³–sp² interface band distortion under high stress, probing unconventional electronic transport for superconducting research.
All-carbon network lattice distortion regulates coherent electron behavior, exploring stress engineering evolution in quantum computing candidate materials.
Each domain here is not isolated product development but the realization of one proposition — controlled sp³–sp² interface energy levels — across physical scales: from 1000W+ thermal shock management to breakthroughs across interface resistance, one bonding logic resolves industry bottlenecks.