A flexible thermal-structure design based on a copper mesh/copper fiber 3D skeleton. Through active fusion-bonding technology, high thermal conductivity particles such as diamond are fixed to a flexible metal skeleton, forming a 3D thermal conductive phase network intended to improve conformity on complex interfaces.
Uses copper mesh or copper fiber as 3D skeleton, providing continuous thermal conduction channels. The skeleton itself has good flexibility, adapting to uneven interfaces and thermal stress deformation.
Through active fusion-bonding technology, high thermal conductivity particles such as diamond and boron nitride are firmly bonded to the metal skeleton, forming stable chemical metallurgical connections for long-term reliability.
Used to improve conformity on complex interfaces, providing flexibility and interface adaptability while maintaining thermal conduction.
Uses micron-scale metal mesh or directionally aligned metal fibers as a 3D thermal scaffold, relying on metal thermal conductivity and ductility to form a continuous heat-conduction network.
Modified carbon-based particles (e.g., diamond, boron nitride) are placed in the pores of the metal skeleton. Interface treatment forms a metallurgical bond with the skeleton and reduces physical gaps at the interface.
Clean the metal skeleton and adjust its surface energy to remove the microscopic oxide layer, improving wettability and bond strength in subsequent brazing.
Disperse coated reinforcement particles and active interface components, then use vacuum assist or physical energy to place the filler in the skeleton pores and form a continuous thermal path.
Under vacuum or a protective atmosphere at low pressure, a set thermal cycle drives in-situ reaction of active elements at the interface, forming a carbide/nitride interface and lowering interface thermal resistance.
Controlled cooling releases internal stress and yields a flexible structure. Surfaces can be flattened or cut to drawing as required.
This design combines metal strength, carbon-based heat transfer, and a compliant structure. It is a design direction for high-performance thermal interface material (TIM) scenarios:
CuFeng provides R&D services from skeleton design and particle formulation optimization to finished-product specification customization. For customer-specific heat flux density needs, performance can be tailored by adjusting interface stress and reinforcement distribution.
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Patent filings cover material composition, interface engineering, and core preparation processes.
This patent defines in detail a systematic method using metal mesh/fiber as structural base and in-situ metallurgical welding to fix high thermal conductivity particles. Its core value is replacing traditional physical doping with interface chemical bonding, intended to improve interface heat transfer efficiency and aging resistance.
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