Flexible thermal pad
A flexible thermal structure built on a copper mesh/fiber 3D skeleton: active fusion bonding fixes high-conductivity particles such as diamond onto the skeleton, forming a 3D conductive network for conformal contact on complex interfaces.
Core performance metrics
Technical advantages
3D skeleton structure
Uses copper mesh or copper fiber as 3D skeleton, providing continuous thermal conduction channels. The skeleton itself has good flexibility, adapting to uneven interfaces and thermal stress deformation.
Active fusion bonding
Through active fusion-bonding technology, high thermal conductivity particles such as diamond and boron nitride are firmly bonded to the metal skeleton, forming stable chemical metallurgical connections for long-term reliability.
Flexibility and thermal conductivity
Improves conformal contact on complex interfaces — flexible and interface-adaptive while maintaining thermal conduction.
Technical principle & preparation
Core structure design
High-performance thermal skeleton selection
Uses micron-scale metal mesh or directionally aligned metal fibers as a 3D thermal scaffold, relying on metal thermal conductivity and ductility to form a continuous heat-conduction network.
- Mesh structure: Regular layout and controllable thickness, suited to large-area consistency.
- Fiber network: 3D interweaving with good flexibility, able to conform to non-flat interfaces.
High thermal conductivity composite reinforcement
Modified carbon-based particles (e.g., diamond, boron nitride) are placed in the pores of the metal skeleton. Interface treatment forms a metallurgical bond with the skeleton and reduces physical gaps at the interface.
Preparation process
Interface activation pretreatment
Clean the metal skeleton and adjust its surface energy to remove the microscopic oxide layer, improving wettability and bond strength in subsequent brazing.
Multi-dimensional dispersion filling
Disperse coated reinforcement particles and active interface components, then use vacuum assist or physical energy to place the filler in the skeleton pores and form a continuous thermal path.
Controlled physical metallurgical bonding
Under vacuum or a protective atmosphere at low pressure, a set thermal cycle drives in-situ reaction of active elements at the interface, forming a carbide/nitride interface and lowering interface thermal resistance.
Precision post-processing and customization
Controlled cooling releases internal stress and yields a flexible structure. Surfaces can be flattened or cut to drawing as required.
Application prospects
Evolution of high thermal conductivity interface materials
This design combines metal strength, carbon-based heat transfer, and a compliant structure. It is a design direction for high-performance thermal interface material (TIM) scenarios:
- New energy powertrain: Ensures long-term thermal safety of battery packs and motor controllers.
- High-integration comm base stations: Addresses extreme heat flux density of 5G/6G RF modules.
- Lightweight electronics: heat spreading under lightweight requirements.
Customized solutions
CuFeng offers R&D from skeleton design and particle formulation to finished-product customization: for specific heat flux demands, performance is tailored via interface stress and reinforcement distribution.
Contact application engineerRelated patent technology
Core intellectual property layout
Patent filings cover material composition, interface engineering, and core preparation processes.
A flexible high-thermal-conductivity composite reinforced by active fusion-bonding metal skeleton and its preparation method
This patent defines in detail a systematic method using metal mesh/fiber as structural base and in-situ metallurgical welding to fix high thermal conductivity particles. Its core value is replacing traditional physical doping with interface chemical bonding, intended to improve interface heat transfer efficiency and aging resistance.
Discuss the design
Welcome to discuss the structural design and application scenarios with the technical team