A material platform based on sp³–sp² carbon-based interface engineering
High power density, CTE mismatch, reliability bottleneck
Coordinated tuning of thermal, mechanical, and electrical performance
Carbon-based interface engineering
sp² / sp³ hybrid bonding
Stress engineering
Tunable endogenous stress field
Multivalent carbon structures
Atomic-scale coexistence of different bonding states
Forming a stable all-carbon covalent bonding network
Forming the structural basis for endogenous stress fields and heterogeneous energy-level environments
Atomic-level interface engineering
sp² structure layer
Atomic covalent bridging
sp³ structure layer
Interface engineering based on sp³–sp² hybrid bonding
Atomic-level interface bonding
Controllable coexistence of carbon atom multi-valency
New thermal interfaces
High-performance heat-spreader substrates
Physical-property and information-function exploration
1. High thermal conductivity diamond-copper composite
Lab-tested thermal conductivity ≥ 680 W/m·K
Room temperature | Laser flash analysis (LFA) | ASTM E1461
2. Capable of sample solution design and preparation
Small-batch custom delivery
Completed lab-level validation across hypothesis, process R&D, and sample trials; initial sample preparation and testing are underway.
Diamond-copper composite samples are stably reproducible; some have passed engineering-level thermal validation and entered optimization.
Core technologies are fully self-developed; key steps are patented, ensuring an independent, continuously evolving technology system.