A material platform based on sp³–sp² carbon-based interface engineering
High power density, CTE mismatch, reliability bottleneck
Coordinated tuning of thermal, mechanical, and electrical performance
Carbon-based interface engineering
sp² / sp³ hybrid bonding
Stress engineering
Tunable endogenous stress field
Multivalent carbon structures
Atomic-scale coexistence of different bonding states
Forming a stable all-carbon covalent bonding network
Providing the structural basis for endogenous stress fields and heterogeneous energy-level environments
Atomic-level interface engineering
sp² structure layer
Atomic covalent bridging
sp³ structure layer
Interface engineering based on sp³–sp² hybrid bonding
Atomic-level interface bonding
Controllable coexistence of carbon atom multi-valency
New thermal interfaces
High-performance heat-spreader substrates
Physical-property and information-function exploration
1. High thermal conductivity diamond-copper composite
Lab-tested thermal conductivity ≥ 680 W/m·K
Room temperature | Laser flash analysis (LFA) | ASTM E1461
2. Capable of sample solution design and preparation
Small-batch custom delivery
Completed lab-level validation from conceptual hypothesis → process R&D → sample trial; preliminary sample preparation and performance testing are underway.
Stable diamond-copper composite samples; some have completed engineering-level validation of key thermal metrics and entered further optimization.
Core technology routes are fully self-developed; key technologies have been patented, ensuring independence and sustainable evolution of the technology system.