2025 marks CuFeng Technology's remarkable transformation from a product-driven company to an intellectual property (IP) platform. Over the year, our R&D team systematically consolidated and transformed years of scattered technical achievements in interface mechanics, atomic-level bonding, and endogenous stress regulation.
Through intensive R&D efforts, we successfully deployed 9 core invention patents. This patent portfolio not only covers preparation processes for high-performance thermal spreaders, but also extends to the underlying physical architecture of sp²-sp³ all-carbon composite materials.
Building this barrier achieves complete coverage from traditional diamond active fusion-bonded tools to cutting-edge all-carbon functional materials, laying a solid legal and technical foundation for the company's commercial licensing and technology transfer in semiconductor thermal management, new energy vehicles, and future physical computing.