In 2025, CuFeng Technology systematically organized and converted technical work in interface mechanics, atomic-level bonding, and endogenous stress regulation into patents.
Nine core invention patents were filed. The portfolio covers preparation of high-performance thermal spreaders and extends to the underlying structure of sp²–sp³ all-carbon composites.
The patents span diamond active fusion-bonded tools through all-carbon functional materials, and support work in semiconductor thermal management, new energy vehicles, and related technology licensing.