As AI chip power density continues to rise (e.g. single-chip power >1000 W), traditional cooling can no longer meet demand. Microchannel liquid cooling is effective but complex to manufacture, costly and prone to clogging. Based on the sp²–sp³ chemical bonding all-carbon composite platform, this solution proposes a thermal management approach combining conformal bulk heat sink with external liquid cold plate. Through 3D surface conformal design and flexible thermal interface material (TIM), it achieves rapid heat diffusion and efficient removal, suitable for ultra-large-scale AI computing systems such as data center servers or edge computing nodes.
The solution core is fabricating all-carbon composite into bulk heat sink with bottom precisely conformal to overall chip structure (including core GPU/CPU and other high-heat-dissipation components), forming conformal matching. Heat sink is large (covering entire chip board), 10–20 mm thick, ensuring sufficient thermal capacity.
Heat transfer path: Chip → TIM: high heat flux regions connect to heat sink via flexible TIM (e.g. carbon fiber felt thermal pad). TIM 0.5–2 mm thick, >20% compression, fills micro-gaps, contact resistance <0.05 K·cm²/W. TIM → all-carbon heat sink: material thermal conductivity 800–1500 W/m·K (or higher), rapidly spreads local hot spots laterally to entire surface (diffusion <0.1 s), uniform temperature differential <5°C. All-carbon heat sink → liquid cold plate: standard liquid cold plate (copper/aluminum + water loop) attached to heat sink surface via thermal pad or direct contact. Liquid cooling handles macroscopic heat removal (flow 10–20 L/min), no microchannels in heat sink.
Material basis: All-carbon composite heat sink uses diamond particles in-situ low-temperature graphitization bonding with sp² carbon host (graphene or carbon nanotubes), forming 3D continuous thermal network. Density only 2–3 g/cm³, lightweight and radiation-resistant, suitable for high-reliability applications.
Combining passive heat diffusion (all-carbon heat sink) and active heat removal (external liquid cooling), this solution excels in ultra-high-power scenarios:
Thermal efficiency: Supports >5000 W (single node), junction temperature reduced 15–30°C, thermal resistance <0.15 K/W.
Uniformity: Conformal design eliminates hot spots, surface temperature distribution <10°C, avoids throttling.
Lightweight: 50–70% weight reduction vs copper-based solution.
Durability: >5000 thermal cycles (-40°C ↔ 150°C) with no structural damage.
Cost-effectiveness: Simple bulk molding, unit cost 200–800 CNY, far below built-in microchannel solutions.
Compared to traditional liquid cooling, this solution simplifies structure, reduces leakage risk, while fully leveraging all-carbon material's intrinsic high thermal conductivity.
In AI server testing, applied to multi-GPU module (total 6000 W): Heat sink conformal to chip protrusions, TIM fills gaps. Liquid cold plate attached to surface, circulating water <50°C. Result: stable operation, junction <70°C, 30% efficiency improvement (COMSOL simulation data).
This solution provides an efficient, reliable innovation path for high-density AI chip heat dissipation, suitable for data centers, edge computing and other fields. We will further optimize material formulation and integration processes. Contact us for technical details or sample testing.