From consumer-grade diamond nonstick coating to cutting-edge all-carbon composites, each technology represents a breakthrough in CuFeng Technology
Achieved 680 W/m·K thermal conductivity; limit-performance version can reach 1000+ W/m·K. Dual product line strategy covering cost-effective civilian and high-end applications.
Flexible thermal solution based on copper mesh/copper fiber. Active fusion bonding of diamond particles forms a 3D skeleton conductive phase with high thermal conductivity and flexibility.
sp³–sp² 3D structure technology platform. Extensible to solid-state battery anodes, superconducting materials, and other frontier fields; 5–10 year core technology reserve.
Patented diamond particle bonding technology for high wear resistance and lasting nonstick performance. Theoretical lifetime improvement up to 10x+, wear resistance improvement up to 10x+; mass production ready.
Based on interfacial chemical metallurgy principles, active fusion bonding achieves atomic-level reliable connection between diamond or cubic boron nitride (CBN) and heterogeneous metal substrates. We go beyond single tools; through precise matching of substrate–superabrasive–fusion alloy, we provide customized precision machining and material removal solutions for aerospace, semiconductor, and advanced composites.
Note: All data above are typical laboratory values or theoretical design values. Due to application conditions and specification differences, actual performance parameters are subject to formal contracts or product manuals.
Our technical team will provide optimal product selection and technical support based on your specific requirements