A material platform based on sp³–sp² carbon-based interface engineering
This platform focuses on AI computing, new energy thermal management, advanced interface materials, and high-hardness, high-conductivity applications, delivering breakthrough thermal management solutions for high-power-density electronic devices.
View Technology ApplicationsInterface engineering based on sp³–sp² hybrid bonding
Atomic-level interface bonding
Controllable coexistence of carbon atom multi-valency
Building a stable all-carbon covalent bonding network
Generating tunable endogenous stress fields and heterogeneous energy-level environments
Based on the same underlying platform, technology is evolving toward:
Our phased results
Completed lab-level closed-loop validation from physical hypothesis → process scheme design → sample trial; preliminary sample preparation and performance testing are underway.
Stable diamond-copper composite samples; some have completed engineering-level validation of key thermal metrics and entered further optimization.
Core technology routes are fully self-developed; key technologies have been patented, ensuring independence and sustainable evolution of the technology system.
Reserved structural & property interfaces
High power density, CTE mismatch, reliability bottleneck
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