In the field of high-performance thermal management, CuFeng Technology has achieved a milestone. After dozens of formulation optimizations and interface wetting experiments, we successfully developed a new generation of diamond-copper composite materials.
Test data shows that the room-temperature thermal conductivity of the material samples stably exceeds 680 W/m·K, far surpassing traditional pure copper (380 W/m·K) and conventional aluminum-silicon carbide materials.
Through unique interface bonding technology, we effectively solved the bonding challenges caused by the thermal expansion coefficient mismatch between diamond and copper. The successful development of this product marks CuFeng Technology's formal entry into the global supplier ranks for thermal solutions for high-power-density electronic devices (such as AI chips and high-power lasers), providing core material support for solving thermal bottlenecks in computing.