Revolutionary all-carbon composite technology platform based on sp²–sp³ chemical bonding. Using nanodiamond surface graphitization as "brazing material," achieves chemical bonding between diamond (sp³) and graphite/carbon fiber (sp²), building a 3D all-carbon network structure. Extensible to thermal management, solid-state batteries, superconducting materials, and other frontier fields.
Breaking through physical contact limits of traditional material interfaces; achieving atomic-level connection between carbon materials through chemical bonding
Data based on ToSpike lab testing and industry patent comparison; parameters may be customized per application.
| Dimension | Diamond-Cu (Cu-based) | Diamond-SiC (SiC-based) | ToSpike All-Carbon (sp²–sp³) | Technical Value |
|---|---|---|---|---|
| Interface bonding | Physical wetting / mechanical interlock | Reaction-sintered layer (brittle) | Atomic-level covalent bonding (strong & tough) | Addresses delamination risk under long-term thermal cycling |
| Phonon transport efficiency | 40%-60% (electron-dominated) | 60%-75% | > 90% (homogeneous phonon coupling) | Breaks through heterogeneous interface thermal resistance |
| Thermal conductivity (TC) | 450–600 W/m·K | 500–700 W/m·K | 500–1000+ W/m·K | Meets next-gen AI chip thermal limits |
| Density (g/cm³) | 6 (heavy) | ~3.2 (medium) | 2.5 (ultra-light) | Up to 70% weight reduction; suitable for aerospace / mobile |
| Thermomechanical reliability | Prone to permanent deformation | Prone to brittle fracture | High modulus + tough skeleton | Stable under extreme vibration / thermal shock |
| Secondary processing | Easy to machine but polluting | Very difficult; precision superhard machining required | Good; supports complex shape forming | Reduces overall manufacturing cost of end components |
| Thermal expansion match | Poor (metal-driven) | Good (ceramic-driven) | Excellent (programmable tuning) | Protects expensive chips from thermal stress damage |
| Functional extensibility | Thermal conduction only | Thermal + electrical insulation | Thermal + electrochemical activity | Tech premium: structure–function integrated component |
Data based on ToSpike lab testing and industry patent comparison; parameters may be customized per application.
Under inert or reducing atmosphere, nanodiamond surface (1–3 nm shell) can undergo graphitization, forming a thin graphitized "soft shell." This shell has sp² hybridization, enabling covalent bonding with sp² structures of other carbon materials.
sp² carbon atoms in the graphitized shell undergo carbon atom diffusion and rearrangement with graphene, carbon fiber, carbon nanotubes and other sp² carbon materials at high temperature, forming C–C covalent bonds for atomic-level chemical bonding between diamond and carbon materials.
Through rational design of diamond particle and sp² carbon material ratio and spatial distribution, builds interconnected sp²–sp³ 3D carbon network structure, combining diamond's high hardness and thermal conductivity with graphite/carbon fiber's electrical conductivity and flexibility.
No metallic phase; avoids metal thermal expansion mismatch, electrochemical corrosion. Lightweight, high strength, excellent chemical stability.
C–C covalent bonding; interface bonding strength far exceeds physical contact or weak van der Waals. Continuous thermal and electrical conduction channels; no interface thermal/electrical resistance.
By adjusting diamond particle size, content, sp² material type (graphene, carbon fiber, nanotubes), thermal conductivity, electrical conductivity, and mechanical properties can be flexibly customized.
Same technical principle extensible to multiple fields: high thermal conductivity materials, solid-state battery anodes, particle electrodes, superconducting materials; broad application prospects.
Multi-domain application potential based on sp²–sp³ platform technology
All-carbon composites have broad application space in high thermal conductivity heat sinks, flexible thermal pads, and solid-state battery anode materials. sp²–sp³ structure provides excellent thermal conduction while meeting porous structure and conductivity requirements for energy storage materials.
View thermal management & energy storage applicationsAs an environmentally friendly material, all-carbon composites can be used for water treatment particle electrodes and electrocatalytic applications. More frontier: high-pressure-induced internal stress may achieve high conductivity or even superconductivity, providing a new material platform for frontier research.
View frontier application areasHeat nanodiamond in inert atmosphere or vacuum to a certain temperature; control time so surface of specific thickness undergoes graphitization to form graphitized shell. Core retains diamond structure.
Mix graphitized nanodiamond with graphene sheets, carbon fiber, carbon nanotubes and other sp² carbon materials at design ratio. Can use solution dispersion, mechanical mixing, or layer-by-layer assembly for uniform distribution.
In vacuum or inert atmosphere hot-press furnace, heat to specific temperature, apply pressure, hold. Graphitized shell and sp² carbon materials undergo carbon atom diffusion, forming C–C covalent bonds.
Control cool to room temperature to obtain sp²–sp³ interconnected all-carbon composite. Can perform cutting, polishing, pore formation, functionalization per application. For solid-state battery, further etch pore-forming agent to form porous structure.
Complete intellectual property protection and technology reserve
Describes in detail nanodiamond surface graphitization, mixing with graphene/carbon fiber, high-temperature pressure sintering. Covers various embodiments for thermal management material applications.
Uses diamond's low-temperature catalytic effect to achieve 3D covalent bonding of sp² carbon network below traditional graphitization temperature; resulting flexible composite achieves breakthrough in electrical/thermal conductivity and mechanical reinforcement efficiency.
Specifically for solid-state battery anode applications; porous sp²–sp³ structure design including pore-forming agent selection, porosity control, electrochemical performance optimization.
Integrated all-solid-state battery design based on sp²–sp³ skeleton; achieves integrated co-sintering of cathode, anode, separator; significantly simplifies process.
Focuses on internal stress structure formed under high pressure and possible superconducting properties. Covers high-end functional materials and frontier research.
5–10 year technology reserve; multi-domain application prospects
We welcome various forms of cooperation with industrial capital, research institutions, and application enterprises. Can provide technology licensing, joint R&D, custom development; jointly promote industrialization of all-carbon composite technology.