Core product of our thermal management technology pivot. We have successfully developed samples with thermal conductivity of 680 W/m·K and planned two product lines: a high cost-performance civilian solution and a limit-performance version exceeding 1000 W/m·K thermal conductivity, which can replace expensive CVD diamond.
Diamond-copper composites are becoming the standard thermal solution for high-power electronic devices. From AI chips to new energy vehicles, from 5G base stations to aerospace, the application prospects are broad.
View full application areasThe cost-effective version targets high-volume civilian markets; the limit-performance version targets high-end industrial applications. Both product lines develop synergistically, covering the full market from consumer to industrial.
Cooperate with usLow-cost high-volume preparation through process optimization, targeting civilian markets and supporting scaled applications.
Active fusion-bonded multi-grade diamond particle composite, 1000+ W/m·K thermal conductivity, can replace expensive CVD solutions for high-end thermal management needs.
Using multi-grade particle size gradient technology, titanium-coated diamond particles build a self-supporting 3D continuous skeleton. Through precise packing optimization, the diamond phase achieves very high volume fraction, forming interconnected high-speed phonon transport channels.
Relying on our self-developed low-melting-point active fusion-bonding alloy system, we have broken through the wettability bottleneck of traditional diamond composites. This technology allows the alloy liquid phase to spontaneously penetrate deep into the complex skeleton with excellent fluidity, building a near-ideal heat transfer network.
Titanium-coated diamond particles are filled into the mold in large, medium, and small order; vibration achieves dense packing to form a 3D continuous porous skeleton.
Active fusion alloy powder is vibration-filled into the pores of the diamond skeleton to ensure uniform distribution.
Heat in a vacuum hot-press furnace above the alloy liquidus, apply pressure and hold. Active elements synergistically form composite carbide interfaces, achieving reliable bonding between diamond and metal matrix.
Cool with the furnace to solidify, forming a fully dense diamond-copper composite structure. Can be further wire-cut to required dimensions.
Complete intellectual property protection system
Discloses a preparation method using multi-grade diamond particle packing to build skeleton and active fusion liquid phase filling. Achieves high thermal conductivity, low cost, and large-size preparation.
Describes in detail key technologies including large, medium, and small diamond particle grading, titanium coating, coating process, and positioning screen-assisted filling.
Our technical team will provide optimal product selection and customized design services based on your thermal requirements