Innovative flexible thermal solution based on copper mesh/copper fiber 3D skeleton. Through active fusion-bonding technology, high thermal conductivity particles such as diamond are fixed to a flexible metal skeleton, forming a 3D thermal conductive phase network with both high thermal conductivity and excellent interface adaptability.
Uses copper mesh or copper fiber as 3D skeleton, providing continuous thermal conduction channels. The skeleton itself has good flexibility, adapting to uneven interfaces and thermal stress deformation.
Through active fusion-bonding technology, high thermal conductivity particles such as diamond and boron nitride are firmly bonded to the metal skeleton, forming stable chemical metallurgical connections for long-term reliability.
Breaks through limitations of traditional rigid thermal materials; while maintaining high thermal conductivity, provides excellent flexibility and interface adaptability, solving thermal conduction challenges in complex assembly scenarios.
Uses precision micron-scale metal mesh or directionally aligned metal fibers as 3D thermal conduction scaffold. Leverages metal's excellent intrinsic thermal conductivity and good mechanical ductility to build continuous heat conduction network.
Within microscopic pores of the metal skeleton, precisely embed modified carbon-based reinforcement particles (e.g., diamond, boron nitride). Through interface affinity engineering, achieve atomic-level metallurgical bonding between reinforcement and metal skeleton, eliminating physical gaps in traditional materials.
Deep cleaning and surface energy regulation of metal skeleton, removing microscopic oxide layers. Through self-developed surface modification process, significantly improves interface wettability and bonding strength in subsequent brazing.
Uniformly disperse specially coated reinforcement particles and active interface components; using vacuum-assisted or high-frequency physical energy, fill the 3D space of the skeleton to build gap-free thermal paths.
Under vacuum or precisely controlled protective atmosphere, through optimized thermal cycle, induce active elements to undergo in-situ chemical reaction at the interface. Process completes under low pressure, achieving stable carbide/nitride interface formation, eliminating interface thermal resistance.
Release internal stress through controlled cooling logic to obtain overall flexible structure with excellent performance. Can undergo surface flattening or precision cutting per design drawings based on end requirements.
This solution combines metal strength, carbon-based rapid heat transfer, and polymer compliance. As next-gen high-performance thermal interface material (TIM), it addresses traditional thermal pad issues of "low thermal conductivity, easy drying/cracking, poor interface conformity," widely applied in:
We provide full-chain R&D services from skeleton design, particle formulation optimization to finished product specification customization. For customer-specific heat flux density needs, through interface stress and reinforcement distribution adjustment, we provide unique performance customization.
Contact application engineerCore intellectual property layout
We have built a solid patent moat covering material composition, interface engineering, and core preparation processes.
This patent defines in detail a systematic method using metal mesh/fiber as structural base and in-situ metallurgical welding to fix high thermal conductivity particles. Its core value is replacing traditional physical doping with interface chemical bonding, fundamentally improving interface heat transfer efficiency and anti-aging reliability.
We provide flexible thermal pad samples with customized dimensions and performance parameters; welcome to contact our technical team